Title Modular teaching and learning offers for contemporary and needed further education
Project Number D/04/B/F/PP-146 157
Product Assembly and Interconnecting Technologies - Soldering in Electronics
Title Assembly and Interconnecting Technologies - Soldering in Electronics
Product Type modules
Module describes basic properties of traditional and lead free solders used in electronics as well soldering production process such as wave soldering and reflow soldering.
Target group Workers in SME, trainers from various area of industry, high school teachers
Soldering as the oldest way how to create metallurgic joints between two metals in hot way is determined by good wet-ability of soldered surfaces by molten solder and therefore, creation of good conditions for effect of adhesive and cohesive forces impact and mutual smelting and diffusion of elements of connected materials and a solder. Module describes materials used for soldering and their properties like: solder-ability chemical consistency, spreading ability and capillarity, viscosity, interfacial tension, electrochemical potential, electric conductivity resistance of joints, creation of intermetalic compounds. One part of module is oriented to solder paste used for reflow soldering, for fixation of components for superficial assembly of soldering Flip Chip. Module is oriented to lead free solders that are presently based on tin. Eutectic system, based on SnAgCu alloy is the most important presently regarding thermal systems. Elemental procedures of soldering technology like wave soldering and reflow soldering is describes in this module too. Module deals with specific problems connecting with optimize of reflow profile used for lead free solders.
Area of application
secondary school, bachelor and master degree
CD, WEB site, word, Power point
on line, of line, E learning