Title Modular teaching and learning offers for contemporary and needed further education
Project Number D/04/B/F/PP-146 157
Product Assembly and Interconnecting Technologies - Printed Circuit Boards
Title Assembly and Interconnecting Technologies - Printed Circuit Boards
Product Type modules
This module discusses grades and specifications of base materials for printed circuit boards (PCB). There are a variety of properties of base materials that are of interest to the printed circuit manufacturer, the assembler, and the end user. These properties fall into the following categories: thermal, physical, mechanical, electrical. In this module an introduction to some of the important properties is provided along with some comparisons of material types. This module describes manufacturing processes for PCB including the transfer of information, design reviews, optimisation of materials, definition of routings, tool creation, and additional processes that are required.
Target group Workers in SME, trainers from various area of industry, high school teachers
The field of base materials can appear deceptively simple. In simple terms, base materials are made up of just three components: the resin system, the reinforcement, and the conductive foil. However, the variants in each of these components and the many possible combinations of these components make the discussion of base materials much more complex. One of the primary reasons for this complexity is the fact that printed circuits are used in so many differing applications. This results in many different sets of requirements in terms of cost and performance, and therefore many grades of base materials. Also, because base materials are the most fundamental components of the printed circuit itself, they interact with virtually every other printed circuit manufacturing process. Therefore, not only are the physical and electrical properties of the materials critical, but their compatibility with manufacturing processes is also of great importance. Many of the key interactions between base materials and printed circuit manufacturing processes are discussed in this module. The manufacturing of printed circuit boards (PCBs) begins with the soft-tooling process. This process is the transformation of customer computer-aided design (CAD) data into the necessary tools required for manufacturing the bare printed circuit board. The typical tools required for manufacturing printed circuit boards include artwork for photoprinting of inner conductive layers, outer conductive layers, and solder mask patterns.
Area of application
secondary school, bachelor and master degree
CD, WEB site, word, Power point
on line, of line, E learning