Title Modular teaching and learning offers for contemporary and needed further education
Project Number D/04/B/F/PP-146 157
Product Assembly and Interconnecting Technologies - Film Technologies
Title Assembly and Interconnecting Technologies - Film Technologies
Product Type modules
This module is oriented to basic physical properties of thin and standard as well polymer thick films used in electronics. Module describes the production processes of thin film technologies as well thick film technologies. Module explains basic principle of polymer thick film technologies and photosensitive thick film technologies.
Target group Workers in SME, trainers from various area of industry, high school teachers
Module characterizes film technologies in principle. The chapters thin film technologies include physical methods of thin film deposition concretely physical vapour deposition, plasma sputtering, and cathode sputtering. Chemical methods of thin film deposition consist of chemical liquid deposition, chemical vapour deposition. Detailed physical principle of screen printing technology is the basis of thick film technology. This part includes description of materials properties for thick film technologies (pastes, substrates) too. Special attention is given for Polymer thick film technology. PTFT are one of the most prospective technologies used for fabricating conductive, resistor and dielectric films. As for a substrate, it is possible to use all standard types of printed circuit boards, ceramics and flexible slides. PTFT’s main purpose is to reduce production costs as opposed to high temperature thick film technology and conventional printed circuit boards. Especially attractive is the realization of conductive connections on the same side of the substrate as corroded Cu motive. This will in turn economize plate-peening on substrate’s other side or another film. Creating motives using photo sensitive thick films is regarded as a progressive method of creating delicate conductive patterns, soldering surfaces and holes within dielectric films fabricated for vertical connection patterns between two conductive films of multiple film structures that have high connection density. One of the most recent and progressive material is called Fodel® (the trademark associated with Dupont). Processes carried out during the Fodel treatment improve the resolution function line/space similarly to thin films. The Fodel material consists of either composition of golden and silver conductors or compatible dielectric material.
Area of application
secondary school, bachelor and master degree
CD, WEB site, word, Power point
on line, of line, E learning