Title Modular teaching and learning offers for contemporary and needed further education
Project Number D/04/B/F/PP-146 157
Product Assembly and Interconnecting Technologies - 3D technology
Title Assembly and Interconnecting Technologies - 3D technology
Product Type modules
The second module proceeds about realization of 3D structures with using standard thick film technology, high temperature cofired ceramics (HTCC), low temperature cofired ceramics (LTCC) and multichip modules. The emphasis is on application of LTCC ceramic in this field as well as on technology of formed modules on the base of LTCC for electronics and hybrid sensors applications.
Target group Workers in SME, trainers from various area of industry, high school teachers
Multilayer structures are 3D systems which are produced from printed conductors that are interconnected each other through isolation layer by vias. Advantage of these structures is possibility to produce inner passive components as resistors, capacitors and inductors which allows saving the place for other components on the surface of structure. There are several ways which allow producing multilayer structures: standard thick film technology (deposition is realized by screen-printing) and high temperature technology which provides better resolution as classical thick film technology, because interconnections are realized by punching directly to substrates. Disadvantage of this technology is high firing temperature (1600oC). Low temperature cofired ceramics are co-fired at 800o – 1000oC which eliminates main disadvantage of high temperature cofired ceramics. Application possibilities of this technology are particularly in field of multichip modules and sensor-based applications. Multichip modules (MCM) are 3D systems which include many interconnected layers with possibility mounting non-packaging chips on structure surface. They are divided into three groups according to realization of technology: MCM-C (Ceramics) based on ceramic materials, MCM-D (Deposited) based on thin film technology and MCM-L (Laminated) based on laminates. 3D modules technology based on LTCC consists of next steps: preparation of LTCC, making via holes, filling via holes, screen-printing, stacking, lamination, firing and post-fired processes. For LTCC processing is needed technological equipments: cutting equipment, isostatic lamination equipment and programmable furnace for firing. LTCC ceramic is material with good mechanical properties. Its advantage is flexibility which allows their utilization in non-conventional formed multilayer modules. The classical process is modified for realization of formed modules, when non-fired structures are formed by re-lamination process before firing. Technology of formed modules is possible to utilize for structure realization in field of electronics and hybrid sensors.
Area of application
secondary school, bachelor and master degree
CD, WEB site, word, Power point
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