Title Modular teaching and learning offers for contemporary and needed further education
Project Number D/04/B/F/PP-146 157
Product Assembly and Interconnecting Technologies - Surface Mounting Technologies
Title Assembly and Interconnecting Technologies - Surface Mounting Technologies
Product Type modules
The sixth module proceeds about surface mounting technology and components packages description for using in this technology and for technologies for chips mounting on substrate as COB (Chip on Board), TAB (Tape Automated Bonding), Flip-Chip and BGA (Ball Grid Array).
Target group Workers in SME, trainers from various area of industry, high school teachers
Surface mounting technology (SMT) presents comprehensive solution of mounting, assembling and interconnection of leaded or leadless components on substrate. Component mounting is realized by flow or reflow soldering or Flip-Chip technology. Advantage of SMT technology is minimized component package which allows good mechanical stability and needn’t forming of leads. In addition, this technology is primary intended for automated assembly through assembly line. Surface mounting devices are delivered as bulk material in rod or tape containers from which are taken off by assembly equipment. The packages we can divide into two groups: leaded and leadless. The first group includes e.g. packages type SO (Small Outline), FP (Flat Pack), QFP (Quad Flat Pack), PLCC (Plastic Leadless Chip Carrier), PGA (Pin Grid Array) etc. The second group includes e.g. packages types MELF (Metal Electrode Face Bonding) and LCCC (Leadless Ceramic Chip Carrier). Analysis of particularly packages group shows the fading of the classic package DIP (Dual In-Line Package) and their substitution with SO packages. Besides the classic packages and SMD exists “direct connection method” which is used for simple chip processing- chip connection and then bonding, TAB (Tape Automated Bonding) technology – non-package chip on film substrate and Flip-chip technology. There are three ways of development in the last years. First one is characterized by high density leads for example computer technique. Second one represents chips mounted on printed circuits boards and oriented on very precisions dimensions of pads. Third one – thin film packages – comprises advantages of both ways. It is very important to adhere correct chip dimensions. Failure choice could caused additional expenses, restricted accessibility and lower benefits mounting process. The choice is conditioned by the next requirements: reliability, package price (component), package dimension and assembly price.
Area of application
secondary school, bachelor and master degree
CD, WEB site, word, Power point
on line, of line, E learning